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| STTH3002C High efficiency ultrafast diode Main product characteristics IF(AV) VRRM Tj(max) VF (typ) trr (typ) 2 x 15A 200 V 175 C 0.75 V 17 ns A1 A2 K A2 A2 A1 K A1 A2 K Features and benefits A1 K Suited for SMPS Low losses Low forward and reverse recovery times High surge current capability High junction temperature Insulated version TOP3I: - Insulated voltage: 2500 Vrms - Capacitance 12 pF I2PAK TO-220AB TO-247 STTH3002CT STTH3002CW STTH3002CR K NC A2 A1 D2PAK STTH3002CG A1 K A2 Description Dual center tab rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in TO-220AB, TO-247, IPAK, DPAK, and TOP3I, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection TOP3I STTH3002CPI Order codes Part Number STTH3002CT STTH3002CW STTH3002CR STTH3002CG STTH3002CG-TR STTH3002CPI Marking STTH3002C STTH3002C STTH3002C STTH3002C STTH3002C STTH3002C April 2006 Rev 2 www.st.com 1/11 Characteristics STTH3002C 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current TO-220AB, TO-247, I2PAK, D2PAK IF(AV) Average forward current, = 0.5 TOP3I IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms Sinusoidal Per diode Tc = 150 C Per device Tc = 145 C Per diode Tc = 125 C Per device Tc = 105 C Value 200 50 15 30 A 15 30 180 -65 to +175 175 A C C Unit V A Table 2. Symbol Thermal parameters Parameter TO-220AB, TO-247, I2PAK, D2PAK Per diode Total Value 1.5 1.0 3.5 C/W Total TO-220AB, TO-247, I2PAK, D2PAK 2.3 0.5 1.1 Unit Rth(j-c) Junction to case Per diode TOP3I Rth(c) Coupling TOP3I When the two diodes 1 and 2 are used simultaneously: Tj(diode 1) = P (diode 1) X Rth(j-c) (Per diode) + P (diode 2) x Rth(c) 2/11 STTH3002C Table 3. Symbol IR(1) Characteristics Static electrical characteristics Parameter Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM IF = 15 A IF = 30 A IF = 15 A IF = 30 A 0.75 Min. Typ Max. 20 A 10 125 1.05 1.18 0.84 0.99 V Unit Reverse leakage current VF(2) Forward voltage drop Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.69 x IF(AV) + 0.01 IF2(RMS) Table 4. Symbol trr IRM tfr VFP Dynamic characteristics Parameter Reverse recovery time Reverse recovery current Forward recovery time Forward recovery voltage Test conditions IF = 1 A, dIF/dt = 200 A/s, VR = 30 V, Tj = 25 C IF = 15 A, dIF/dt = 200 A/s, VR = 160 V, Tj = 125 C IF = 15 A, dIF/dt = 200 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 15 A, dIF/dt = 200 A/s, Tj = 25 C 2.5 Min. Typ 17 6 Max. 22 7.8 110 Unit ns A ns V Figure 1. Peak current versus duty cycle (per diode) Figure 2. Forward voltage drop versus forward current (typical values, per diode) IM(A) 120 IFM(A) 100 90 100 IM T 80 70 tp Tj=150C 80 =tp/T P = 30W 60 50 60 P = 15W 40 40 30 Tj=25C P = 10W 20 20 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 10 0 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 1.8 3/11 Characteristics STTH3002C Figure 3. Forward voltage drop versus forward current (maximum values, per diode) Figure 4. Relative variation of thermal impedance junction to case versus pulse duration IFM(A) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Tj=25C Zth(j-c)/Rth(j-c) 1.0 Tj=150C Single pulse VFM(V) 0.1 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 Figure 5. Junction capacitance versus reverse applied voltage (typical values, per diode) F=1MHz VOSC=30mVRMS Tj=25C Figure 6. Reverse recovery charges versus dIF/dt (typical values, per diode) C(pF) 1000 250 225 200 175 150 Qrr(nC) IF=15A VR=160V Tj=125C 100 125 100 75 50 Tj=25C VR(V) 10 0 50 100 150 200 25 0 10 dIF/dt(A/s) 100 1000 Figure 7. Reverse recovery time versus dIF/dt (typical values, per diode) Figure 8. Peak reverse recovery current versus dIF/dt (typical values, per diode) trr(ns) 70 60 50 40 30 20 Tj=25C IF=15A VR=160V IRM(A) 14 13 12 11 Tj=125C IF=15A VR=160V 10 9 8 7 6 5 4 3 2 1 0 1000 Tj=25C Tj=125C 10 dIF/dt(A/s) 0 10 100 dIF/dt(A/s) 10 100 1000 4/11 STTH3002C Ordering information scheme Figure 9. Dynamic parameters versus junction temperature Figure 10. Thermal resistance junction to ambient versus copper surface under each tab (Epoxy printed circuit board FR4, eCU = 35 m) for D2PAK Rth(j-a)( C/W) 80 70 60 Qrr;IRM[Tj]/Qrr;IRM[Tj=125C] 1.4 IF=15A VR=160V 1.2 1.0 IRM 50 40 30 0.8 Qrr 0.6 0.4 0.2 20 10 Tj(C) 0.0 25 50 75 100 125 150 SCU(cm) 0 0 2 4 6 8 10 12 14 16 18 20 2 Ordering information scheme STTH 30 02 Cxx Ultrafast switching diode Average forward current 30 = 30 A Repetitive peak reverse voltage 02 = 200 V Package CT = TO-220AB CW = TO-247 CG = D2PAK CR = I2PAK CPI = TOP3I 5/11 Package information STTH3002C 3 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. TO-220AB Dimensions DIMENSIONS REF. Millimeters Min. A a1 B OI L F A I4 l3 a1 l2 c2 b2 C Inches Min. Typ Max. 0.625 0.147 Typ Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C c1 c2 e 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 a2 M b1 e c1 F OI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 1.70 1.70 0.104 0.044 0.044 0.102 0.116 0.066 0.066 6/11 STTH3002C Table 6. TO-247 Dimensions Package information DIMENSIONS REF. Millimeters Min. A D E B OI L F A I4 l3 a1 l2 c2 b2 C Inches Min. 0.191 0.086 0.015 0.039 0.118 0.078 Typ Max. 0.203 0.102 0.031 0.055 Typ Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 F F1 F2 F3 F4 G H 2.40 3.40 0.078 0.118 0.429 0.094 0.133 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.620 0.793 0.169 a2 L M L1 c1 b1 e L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 7/11 Package information Table 7. I2PAK Dimensions DIMENSIONS REF. Millimeters Min. B OI L F A I4 l3 a1 l2 c2 b2 C STTH3002C Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 A A1 b b1 c c2 D e M 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 a2 b1 e c1 e1 E L L1 L2 Table 8. TOP3I dimensions DIMENSIONS REF H Millimeters Min. Max. 4.6 Inches Min. 0.173 Max. 0.181 A A R OL B 4.4 B C D F G 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 1.55 15.60 0.7 2.9 16.5 21.1 15.5 5.65 3.65 4.17 1.40 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.213 0.134 0.161 0.047 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 K E F P G C H J D E J J K OL P R 4.60 Typ. 0.181 Typ. 8/11 STTH3002C Table 9. D2PAK dimensions Package information DIMENSIONS REF. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D B2 C L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C2 C D E G L V2 L2 L3 M R V2 0.40 typ. 0 8 0.016 typ. 0 8 Figure 11. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH3002C 4 Ordering information Part Number STTH3002CT STTH3002CW STTH3002CR STTH3002CG STTH3002CG-TR STTH3002CPI Marking STTH3002C STTH3002C STTH3002C STTH3002C STTH3002C STTH3002C Package TO-220AB TO-247 I2PAK D2 D2 PAK PAK Weight 2.23 g 4.46 g 1.49 g 1.48 g 1.48 g 4.7 g Base qty 50 30 50 50 1000 30 Delivery mode Tube Tube Tube Tube Tape and reel Tube TOP3I 5 Revision history Date Feb-2004 05-Apr-2006 Revision 1 2 First issue Reformatted to current template. Package TOP3I added. Description of Changes 10/11 STTH3002C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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